Flexible Substrates

Flexible Substrates at Heraeus are an innovative combination of different production technologies. Approved proceedings like stamping and electroplating can be combined with modern laminating technology which allows structured multilayer systems mostly with metal and synthetic materials.

Very fine structures with material and geometry dimensions under 100 µm can be easily achieved by stamping technology. Metallic substrates can be plated with different functional surfaces to achieve the favored property. Our accurate laminating technology allows to connect several structured layers with high precision.

Etching technology is an additional perfect solution for prototyping and mass production with low quantities. Furthermore it is a convenient possibility for customers to optimize costs during start-up.

Following technologies are used for our "Flexible Substrates":

LED-Substrate

RFID-Chip Carrier