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Micro injection moulding

The demands placed on Micro-Electro-Mechanical Systems (MEMS) and sensors are continually increasing. In particular where electronic components are concerned, ever more complex functions are being compressed on to ever less amounts of space. We have a range of innovative concepts in the field of micro injection moulding at our disposal in connection with flexible substrates (simultaneous punching/laminating technology ) and provide our customers with tailor-made solutions.
Through the use of the most modern machinery available, stable production processes are virtually guaranteed. Due to the short cycle times involved, the manufacturing costs may also be considerably reduced. Optimal injection processes and 100 % optical quality controls further ensure that production of the highest quality is achieved.
Part weights < 1g and structures < 0,1mm are typical when talking about micro injection moulded parts. At Heraeus we already realized a component carrier with serial-production conditions with a part weight of 0,17g and a high tech synthetic.
Mirco injection moulding; mirco technology